The main objective of Parastretch is to develop new cost-effective and high-throughput manufacturing methods for heterogeneous integration on stretchable substrates, using microscopic rain on patterned superhydrophobic surfaces.

Assembly is a crucial step of many emerging technologies in micro- and nanosystem integration. Surface tension driven self-alignment has already been applied in many demonstrations, including massively parallel microassembly and fluidic self-assembly. Impressive results have been reported like 62,500 chips assembled in 45 seconds with sub-micro precision and implementation of automated reel-to-reel fluidic self-assembly machine. Recently, a so called hybrid microassembly technique combining robotic pick-and-place with surface tension driven self-alignment has been reported, which can achieve more deterministic results and new designs that are not possible with self-assembly alone. We are forwarding this hybrid approach to provide self-alignment of small components in stretchable electronics, reducing the problems of precisely aligning to a pattern that is both stretched and sheared.

Chang is post-doc and funded by the Academy of Finland, AKA. This is in collaboration with the groups of Zhou Quan and Robin Ras, Aalto University, Finland.

People involved: Bo Chang, Seunghee Jeong, Zhigang Wu and Klas Hjort.