Our laboratory provides a well equipped platform for mechanical and biological research activities, which is well maintained by experienced researchers. The lab offers mordern HITACHI TM-100 In-situ SEM, Multifunctional Instron Machine, Shimudzu Tensile Tester, Digital Speckle Photography (DSP), X-ray Tomography, Instrumented Ultramicrotome, etc., and is also opened to researchers not in this group. These machines can be booked via the Ångström booking system.
HITACHI TM-100 TABLETOP MICROSCOPE
Tabletop SEM (Hitachi TM-100)
Hitachi TM-100 Tabletop Microscope is the perfect imaging platform for any Light Microscope lab needing higher resolution and deeper focus depth. Requiring no electron microscopical technical skills or sample preparation techniques. It's that easy! TM-1000 images show sample surface morphology in contrast due to different average atomic number composition within the sample.
Detector: Solid State Backscattered Electron Detector (BSE) Electron gun: Pre-centered cartridge filament Magnification: 20 - 10.000 X (Digital Zoom : 4 X) Maximum Sample Size: 70mm in diameter Maximum Sample Height: 20mm high Specimen traverse: X: 15mm, Y: 18mm Pressure Mode: Standard Mode/Charge-up reduction mode Evacuation System: Turbo Molecular Pump (TMP) & Diaphragm PUMP.
X-ray Micro Computed Tomography (Micro-CT)
X-ray Tomography (Skyscan 1172)
X-rays Micro computed tomography (Micro-CT) is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It could generate 3D images of your sample’s morphology and internal micro-structure with resolution down to the sub-micron level where very fine scale internal structure of objects is imaged non-destructively. The system also equipped with a loading stage which allows the user to combine micro-CT imaging with tensile and compression testing. A series of advanced software is also included for realistic visualization and morphometric quantitative analysis in 2D/3D.
Resolution: <1μm Load cell capability: 440N Displacement sensor accuracy: ± 0.01mm Maximum object diameter: 20mm Maximum travel: 5.5mm
Shimadzu Autograph AGS-X
Shimadzu AGS-X Tensile tester
The AGS-X series sets a new standard for strength evaluations while providing the utmost in safety considerations in a modern, stylish design. The AGS-X comes standard with industry-leading TRAPEZIUM X data processing software which provides enhanced productivity and efficiency for quality control operations.
Effective test width 425mm; Sampling speed 1ms max.; Load cell 10KN,10N; Accuracy High-precision type (1/500, ±0.5%): Within ±0.5% indicated test force (at 1/500 to 1/1 load cell rating); Standard-precision type (1/500, ±1%): Within ±1% indicated test force (at 1/500 to 1/1 load cell rating). Crosshead Speed range: 0.001 to 1000 mm/min (stepless); Max. Return speed: 1500 mm/min; Speed accuracy: ±1%; Crosshead-table distance: 1200mm.
Aramis Digital Speckle Photography (DSP) Equipment
ARAMIS Digital Speckle Photography (DSP)
ARAMIS Digital Speckle Photography (DSP) equipment is a measuring system which provides 2D/3D results such as surface coordinates, surface strain values, strain rates, displacements and velocities for both static and dynamic mechanics tests. ARAMIS is a robust solution for full-field analysis of small specimens (mm) up to large components (multiple m). Measurements are carried out independently from geometry and temperature without time-consuming and expensive specimen preparation.
5M Frame rate (Hz) Up to 15(29); Camera resolution (Pixel) 2448 × 2052; Measuring area mm2 to >m2; Strain measuring range (%) 0.01 up to 100; Strain measuring accuracy (%) Up to 0.01; Operating temperature 5-40 °C; Specimen temperature typ. -100°C up to +1500°C.
In material Micro/nano mechanics, there are virtually no direct experimental results accessible for analysis of local fracture. In our study, an instrumented ultramicrotome was built for the micro/nano-scaled investigation of local fractures. It makes it possible to quantitatively analysed the effects of material composition, nanostructure, toughening additives, etc.
With a super sharp (the radius of knife edge r=7 nm) diamond knife, ultrathin chips (down to 30 nm ) can be sliced from the work material (polymers, wood, biomaterial), with sectioning forces recorded by two piezoelectron sensors (up to 0.1 mN).